本書是一本介紹半導體集成電路和器件制造技術的專業書籍，在半導體領域享有很高的聲譽。本書的范圍包括半導體工藝的每個階段：從原材料的制備到封裝、測試和成品運輸，以及傳統的和現代的工藝。全書提供了詳細的插圖和實例，每章包含回顧總結和習題，并輔以豐富的術語表。第六版修訂了微芯片制造領域的新進展，討論了用于圖形化、摻雜和薄膜步驟的先進工藝和尖端技術，使隱含在復雜的現代半導體制造材料和工藝中的物理、化學和電子的基礎知識更易理解。本書的主要特點是避開了復雜的數學問題介紹工藝技術內容；加入了半導體業界的新成果，可以使讀者了解工藝技術發展的趨勢。
Peter Van Zant 國際知名半導體專家，具有廣闊的工藝工程、培訓、咨詢和寫作方面的背景。他曾先后在IBM和德州儀器（TI）工作，之后在硅谷，又先后在美國國家半導體（National Semiconductor）和單片存儲器（Monolithic Memories）公司任晶圓制造工藝工程和管理職位。他還曾在加利福尼亞州洛杉磯的山麓學院（Foothill College）任講師，講授半導體課程和針對初始工藝工程師的高級課程。
1 The Semiconductor Industry
Introduction
Birth of an Industry
The Solid-State Era
Integrated Circuits (ICs)
Process and Product Trends
Moore’s Law
Decreasing Feature Size
Increasing Chip and Wafer Size
Reduction in Defect Density
Increase in Interconnection Levels
The Semiconductor Industry Association Roadmap
Chip Cost
Industry Organization
Stages of Manufacturing
1 The Semiconductor Industry
Introduction
Birth of an Industry
The Solid-State Era
Integrated Circuits (ICs)
Process and Product Trends
Moore’s Law
Decreasing Feature Size
Increasing Chip and Wafer Size
Reduction in Defect Density
Increase in Interconnection Levels
The Semiconductor Industry Association Roadmap
Chip Cost
Industry Organization
Stages of Manufacturing
Six Decades of Advances in Microchip Fabrication Processes
The Nano Era
Review Topics
References
2 Properties of Semiconductor Materials and Chemicals
Introduction
Atomic Structure
The Bohr Atom
The Periodic Table of the Elements
Electrical Conduction
Conductors
Dielectrics and Capacitors
Resistors
Intrinsic Semiconductors
Doped Semiconductors
Electron and Hole Conduction
Carrier Mobility
Semiconductor Production Materials
Germanium and Silicon
Semiconducting Compounds
Silicon Germanium
Engineered Substrates
Ferroelectric Materials
Diamond Semiconductors
Process Chemicals
Molecules, Compounds, and Mixtures
Ions
States of Matter
Solids, Liquids, and Gases
Plasma State
Properties of Matter
Temperature
Density, Specic Gravity, and Vapor Density
Pressure and Vacuum
Acids, Alkalis, and Solvents
Acids and Alkalis
Solvents
Chemical Purity and Cleanliness
Safety Issues
The Material Safety Data Sheet
Review Topics
References
3 Crystal Growth and Silicon Wafer Preparation
Introduction
Semiconductor Silicon Preparation
Silicon Wafer Preparation Stages
Crystalline Materials
Unit Cells
Poly and Single Crystals
Crystal Orientation
Crystal Growth
Czochralski Method
Liquid-Encapsulated Czochralski
Float Zone
Crystal and Wafer Quality
Point Defects
Dislocations
Growth Defects
Wafer Preparation
End Cropping
Diameter Grinding
Crystal Orientation, Conductivity, and Resistivity Check
Grinding Orientation Indicators
Wafer Slicing
Wafer Marking
Rough Polish
Chemical Mechanical Polishing
Backside Processing
Double-Sided Polishing
Edge Grinding and Polishing
Wafer Evaluation
Oxidation
Packaging
Wafer Types and Uses
Reclaim Wafers
Engineered Wafers (Substrates)
Review Topics
References
4 Overview of Wafer Fabrication and Packaging
Introduction
Goal of Wafer Fabrication
Wafer Terminology
Chip Terminology
Basic Wafer-Fabrication Operations
Layering
Patterning
Circuit Design
Reticle and Masks
Doping
Heat Treatments
Example Fabrication Process
Wafer Sort
Packaging
Summary
Review Topics
References
5 Contamination Control
Introduction
The Problem
Contamination-Caused Problems
Contamination Sources
General Sources
Air
Clean Air Strategies
Cleanroom Workstation Strategy
Tunnel or Bay Concept
Micro- and Mini-Environments
Temperature, Humidity, and Smog
Cleanroom Construction
Construction Materials
Cleanroom Elements
Personnel-Generated Contamination
Process Water
Process Chemicals
Equipment
Cleanroom Materials and Supplies
Cleanroom Maintenance
Wafer-Surface Cleaning
Particulate Removal
Wafer Scrubbers
High-Pressure Water Cleaning
Organic Residues
Inorganic Residues
Chemical-Cleaning Solutions
General Chemical Cleaning
Oxide Layer Removal
Room Temperature and Ozonated Chemistries
Water Rinsing
Drying Techniques
Contamination Detection
Review Topics
References
6 Productivity and Process Yields
Overview
Yield Measurement Points
Accumulative Wafer-Fabrication Yield
Wafer-Fabrication Yield Limiters
Number of Process Steps
Wafer Breakage and Warping
Process Variation
Mask Defects
Wafer-Sort Yield Factors
Wafer Diameter and Edge Die
Wafer Diameter and Die Size
Preface
FromthePrefaceoftheFirstEdition:“Asthesemiconductorindustrybecomesmoreimportantintheeconomy,morepeoplewillbeinvolvedintheindustry.ItismyintentionthatMicrochipFabricationwillservetheirneeds.”Indeedthesemiconductorindustryhasgrownintoamajorinternationalindustrialsegment.Thesemiconductormaterialsandequipmentindustrieshavealsogrownintomajorindustrialsectors.ThiseditionhasfollowedthegoaloftheFirstEditiontoservethetrainingneedsofwafer-fabricationworkers,whethertheybeproductionworkers,technicians,professionalsinthematerialsandequipmentsectors,orengineers.
TheSixthEditionretainsthephysics,chemistry,andelectronicfundamentalsunderlyingthesophisticatedmanufacturingmaterialsandprocessesofthemodernsemiconductorindustry.Itgoesontoprofilethestate-of-the-artprocessesthathavegrownfromthesimplelaboratoryproductionslinesofthe1960s.Noteveryindividualprocessflowcanbedetailedinanintroductorytext.Butcurrenttechnologiesusedinthepatterning,doping,andlayeringstepsareexplained.Theintentionofthisbookisthatthereaderwillgainenoughgeneralknowledgetobeabletokeepabreastofnewprocessesandequipment.
IamindebtedtothevaluableinputfromAnneMillerandDr.MichaelHynesatSemiconductorServices,BillMoffatthefounderandPresidentofYieldEngineeringSystems,andDonKeenan,processengineerextraordinaire.
KudostoSeniorEditorMichaelMcCabeandhisstaffatMcGraw-Hillfortheirsupportandguidance.AndathankstoSheenaUprety,AssociateProjectManageratCenveoPublisherServices,andthecopyeditor,RaginiPandey,forturningmymanuscriptintoaready-for-productiontext.
And,ofcourse,ashoutouttomyeversupportiveandpatientwife,MaryDeWitt.Sheeditedthefirstedition,hasgivenmeencouragementduringthewritingofeveryedition,andhaslenthereagleeyetothislatestedition.
NotetoInstructors:Ifyouareaninstructorusingthisbookasatextbook,thenthereisanInstructor’sManualavailableatwww.mhprofessional.com/mf6e.
PeterVanZant
封底內容：
本書是一本介紹半導體集成電路和器件制造技術的專業書籍，在半導體領域享有很高的聲譽。本書的范圍包括半導體工藝的每個階段：從原材料的制備到封裝、測試和成品運輸，以及傳統的和現代的工藝。全書提供了詳細的插圖和實例，每章包含回顧總結和習題，并輔以豐富的術語表。第六版修訂了微芯片制造領域的新進展，討論了用于圖形化、摻雜和薄膜步驟的先進工藝和尖端技術，使隱含在復雜的現代半導體制造材料和工藝中的物理、化學和電子的基礎知識更易理解。本書的主要特點是避開了復雜的數學問題介紹工藝技術內容；加入了半導體業界的新成果，可以使讀者了解工藝技術發展的趨勢。
內容提要
●半導體產業
●半導體材料和化學品的特性
●晶體生長和硅晶圓的制備
●晶圓制造和封裝
●污染控制
●生產能力和工藝良率
●氧化
●從表面制備、曝光、顯影到
最終檢驗的十步圖形化工藝
●下一代光刻技術
●摻雜
●薄膜淀積
●金屬化
●工藝和器件的評估
●晶圓制造中的商業因素
●器件和集成電路的形成
●集成電路
●封裝
PeterVanZant國際知名半導體專家，具有廣闊的工藝工程、培訓、咨詢和寫作方面的背景。他曾先后在IBM和德州儀器（TI）工作，之后在硅谷，又先后在美國國家半導體（NationalSemiconductor）和單片存儲器（MonolithicMemories）公司任晶圓制造工藝工程和管理職位。他還曾在加利福尼亞州洛杉磯的山麓學院（FoothillCollege）任講師，講授半導體課程和針對初始工藝工程師的高級課程。
……
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